2025_Stegmann_Enhancing_Silver_Sintering

Updated research and raw data to publication: Enhancing Silver Sintering - Effect of Copper Substrate Microstructure on Silver Adhesion and Bond Strength

Identifier
Source https://tudatalib.ulb.tu-darmstadt.de/handle/tudatalib/4566
Metadata Access https://tudatalib.ulb.tu-darmstadt.de/server/oai/openairedata?verb=GetRecord&metadataPrefix=oai_datacite&identifier=oai:tudatalib.ulb.tu-darmstadt.de:tudatalib/4566
Provenance
Creator Stegmann, Tamira; Bruder, Enrico; Gunst, Stefan; Schwöbel, André; Durst, Karsten
Publisher Technische Universität Darmstadt
Contributor Technische Universität Darmstadt
Publication Year 2025
Rights Creative Commons Attribution 4.0 International; info:eu-repo/semantics/openAccess; https://creativecommons.org/licenses/by/4.0
OpenAccess true
Contact https://tudatalib.ulb.tu-darmstadt.de/docs/en/kontakt/
Representation
Language English
Resource Type Dataset
Format application/zip
Size 580.57 MB
Version Updated version after peer review
Discipline Other