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2025_Stegmann_Enhancing_Silver_Sintering
Updated research and raw data to publication: Enhancing Silver Sintering - Effect of Copper Substrate Microstructure on Silver Adhesion and Bond Strength -
2025_Stegmann_Enhancing_Silver_Sintering
Research and raw data to publication: Enhancing Silver Sintering - Effect of Copper Substrate Microstructure on Silver Adhesion and Bond Strength
