Replication Data for: Ultraviolet photodetectors and readout based on a‐IGZO semiconductor technology

DOI

This dataset holds all measurement data, as well as the evaluation and plotting scripts to replicate all figures of the paper.

The data is structured in folders of the figures. In the most cases a folder includes the figure (.pdf), a subfolder named Plot and a subfolder named Raw data and evaluation script. The Plot folder contains the plotting script (.py) and the plotted data (.txt). The Raw data and evaluation script folder contains the recorded (unprocessed) data (.csv, .xlxs) and a python script (.py), which generates the plotted data from the raw data.

More information can be found in the ReadMe.txt.

Identifier
DOI https://doi.org/10.18419/DARUS-5049
Related Identifier IsSupplementTo https://doi.org/10.1002/jsid.1202
Metadata Access https://darus.uni-stuttgart.de/oai?verb=GetRecord&metadataPrefix=oai_datacite&identifier=doi:10.18419/DARUS-5049
Provenance
Creator Schellander, Yannick (ORCID: 0000-0002-9790-262X); Winter, Marius (ORCID: 0009-0006-3646-700X); Schamber, Maurice ORCID logo; Munkes, Fabian (ORCID: 0000-0002-2964-813X); Schalberger, Patrick ORCID logo; Kübler, Harald ORCID logo; Pfau, Tilman ORCID logo; Fruehauf, Norbert ORCID logo
Publisher DaRUS
Contributor Schellander, Yannick; General Email of the Institute for Large Area Microlectronics
Publication Year 2025
Funding Reference DFG 431314977
Rights CC BY 4.0; info:eu-repo/semantics/openAccess; http://creativecommons.org/licenses/by/4.0
OpenAccess true
Contact Schellander, Yannick (University of Stuttgart); General Email of the Institute for Large Area Microlectronics (University of Stuttgart)
Representation
Resource Type Dataset
Format text/tab-separated-values; text/plain; text/x-python; application/postscript; image/png; text/plain; charset=US-ASCII; application/vnd.ms-excel; application/octet-stream; text/csv; text/comma-separated-values; application/vnd.openxmlformats-officedocument.spreadsheetml.sheet
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Version 1.0
Discipline Construction Engineering and Architecture; Engineering; Engineering Sciences; Natural Sciences; Physics