Data for: High-performance epoxy/binary spherical alumina composite as underfill material for electronic packaging

Dataset

DOI PID

Flowability of EP-S-Al2O3 binary composite; AC conductivity, thermal conductivity and shear viscosity of EP-S-Al2O3 binary composites.

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Identifier
DOI	https://doi.org/10.17632/d7xvd77rfp.1
PID	https://nbn-resolving.org/urn:nbn:nl:ui:13-0t-wvsn
Metadata Access	https://easy.dans.knaw.nl/oai?verb=GetRecord&metadataPrefix=oai_datacite&identifier=oai:easy.dans.knaw.nl:easy-dataset:291048

Provenance
Creator	Shi, D
Publisher	Data Archiving and Networked Services (DANS)
Contributor	Dean Shi
Publication Year	2018
Rights	info:eu-repo/semantics/openAccess; License: http://creativecommons.org/licenses/by/4.0; http://creativecommons.org/licenses/by/4.0
OpenAccess	true

Representation
Resource Type	Dataset
Discipline	Other